Definition – What does HSF (Heat Sink and Fan) mean?
Heat Sink and Fan (HSF) is an active cooling solution that is used to cool down integrated circuits in computer systems including a central processing unit. As the name suggests, it is composed of a passive cooling unit and fan. HSF is usually made with a high-temperature conductive material such as copper and aluminum, and the fan is a DC brushless fan that is the standard used for computer systems.
Glossary Web explains HSF (Heat Sink and Fan)
HSF (Heat sink and fan) is often used in a modern computer system in order to keep the processor cool. Without HSF, the processor cloud easily overheats and become damaged. Therefore, heat sink and fan combination are often found in most low-to mid-range computer systems and even in the high-end notebooks. However, for computer systems and PCs that boast a more powerful processor, a more powerful cooling system is required.
The heat sink (HS) is a thermally conductive material that rapidly carries heat away from the CPU. It is created to have the highest amount of surface area in a small volume of space, so aside from the flat surface, the heat sink has numerous thin fins that enable heat dissipation through thermal convection that means the heat is further carried away from the heat sink itself by air. Frequently the normal flow of air is not enough to let for quick cooling, so the fan has to be added. Together, the Heat Sink and Fan is the least expensive cooling solution available, with efficiency varying according to the heat sink design and fan power.